A method of making an encapsulated OLED panel with a pass-through hole comprising: creating a pass-through hole with side walls within the central emission area of an OLED panel; providing at least a first support element arranged in contact with a portion of a face of the OLED panel and overlapping the edge of the hole such that a portion of the support element is located above or within the hole and is spaced from the side walls; and providing a sealant in contact with the first support element and desirably, the side walls as well. Both the first support element and sealant provide a barrier to moisture and oxygen from entering the internal OLED structures through the cut side wall formed during the creation of the pass-through hole in a previously encapsulated OLED panel.