Invention Grant
- Patent Title: Contact assembly for high-current applications
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Application No.: US16282755Application Date: 2019-02-22
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Publication No.: US10707599B2Publication Date: 2020-07-07
- Inventor: Alexander Dauth , Gerd Braeuchle , Ramona Grundmeier
- Applicant: BorgWarner Inc.
- Applicant Address: US MI Auburn Hills
- Assignee: BorgWarner Inc.
- Current Assignee: BorgWarner Inc.
- Current Assignee Address: US MI Auburn Hills
- Agency: Howard & Howard Attorneys PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@71d20245
- Main IPC: H01R12/70
- IPC: H01R12/70 ; H01R12/57 ; F02B39/10 ; H01R12/58 ; H01R13/03 ; H01R13/11 ; H05K1/18 ; H01R12/71

Abstract:
Contact assembly for high-current applications, comprising an electric circuit board (3); a non-flexible conductor rod (1) protruding in a longitudinal direction, the conductor rod (1) transmitting an electric current of more than 30 Ampere, in particular more than 50 Ampere, between the circuit board (3) and an electric device; and a receiving member (2), the receiving member (2) being fixed to the circuit board (3); wherein the receiving member (2) holds the conductor rod (1) and transmits the current between the conductor rod (1) and the circuit board (3); wherein the receiving member (2) comprises a plurality of elastically deformable tongues (5), the tongues (5) being arranged circumferentially about the conductor rod (1) and providing for a mechanical support as well as an electric contact between the conductor rod (1) and the receiving member (2).
Public/Granted literature
- US20190267731A1 CONTACT ASSEMBLY FOR HIGH-CURRENT APPLICATIONS Public/Granted day:2019-08-29
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