A method for producing a soldered connection between at least two components is provided, in which the components are heated for melting a solder in a soldering area. The heating of the soldering area and/or the supply of solder to the soldering area is realized depending on the temperature which is determined by non-contact detection of heat radiation emitted from at least one temperature measurement zone of one of the components. In order to improve the method such that the emissivity of the at least one temperature measurement zone can be increased with high process reliability and with at most a slight adverse effect on the electrical connection between the electrical components, it is proposed that the at least one temperature measurement zone be locally heated for increasing its emissivity. Furthermore, an electrical plug-in connector for producing a soldered connection and use of such a plug-in connector are proposed.