Invention Grant
- Patent Title: Housing for an electronic component, and laser module
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Application No.: US15430060Application Date: 2017-02-10
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Publication No.: US10707642B2Publication Date: 2020-07-07
- Inventor: Robert Hettler , Michelle Fang
- Applicant: SCHOTT AG
- Applicant Address: DE Mainz
- Assignee: SCHOTT AG
- Current Assignee: SCHOTT AG
- Current Assignee Address: DE Mainz
- Agency: Ohlandt, Greeley, Ruggiero & Perle, L.L.P.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2804772d
- Main IPC: H01S5/022
- IPC: H01S5/022 ; H01L23/10 ; H01S5/024
Abstract:
A housing for an electronic component, in particular for a laser diode, is provided. The housing includes a mounting area for the electronic component and has a lateral wall provided with a feedthrough for a light guide. The base wall of a basic body of the housing has both a heat sink for a thermoelectric cooler and a plurality of feedthroughs for pins for electrically connecting the electronic component.
Public/Granted literature
- US20170229841A1 HOUSING FOR AN ELECTRONIC COMPONENT, AND LASER MODULE Public/Granted day:2017-08-10
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