Invention Grant
- Patent Title: Laser light source module
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Application No.: US16375149Application Date: 2019-04-04
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Publication No.: US10707643B2Publication Date: 2020-07-07
- Inventor: Daisuke Morita , Kazutaka Ikeda , Motoaki Tamaya
- Applicant: MITSUBISHI ELECTRIC CORPORATION
- Applicant Address: JP Chiyoda-Ku, Tokyo
- Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee Address: JP Chiyoda-Ku, Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- Main IPC: H01S5/00
- IPC: H01S5/00 ; H01S5/022 ; H01S5/024 ; H01S5/40

Abstract:
The purpose of the present invention is to provide a laser light source module that is capable of heat dissipation from a laser device and of suppressing the diffusion of a light beam due to the close arrangement of the laser device. The laser light source module comprises a stem that is a base plate and first and second laser assemblies disposed on the stem. Each of the laser assemblies comprises a multi-emitter LD bar that is a laser device emitting a laser light along an optical axis, and a holding member having a mounting surface parallel to the axis, the multi-emitter LD bar being mounted on the mounting surface. The first and second laser assemblies are positioned such that the optical axes of the assemblies are parallel to each other and that the mounting surfaces of the assemblies are arranged opposite to each other in parallel.
Public/Granted literature
- US20190229491A1 LASER LIGHT SOURCE MODULE Public/Granted day:2019-07-25
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