Invention Grant
- Patent Title: Elastic wave device and method for manufacturing the same
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Application No.: US15376816Application Date: 2016-12-13
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Publication No.: US10707830B2Publication Date: 2020-07-07
- Inventor: Taku Kikuchi , Seiji Kai , Motoji Tsuda , Mitsuyoshi Hira
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5f2b6d08
- Main IPC: H03H9/02
- IPC: H03H9/02 ; H03H3/08 ; H03H9/10 ; H03H9/05 ; H03H9/64

Abstract:
An elastic wave device includes a piezoelectric substrate, functional electrodes on the piezoelectric substrate, a support layer on the piezoelectric substrate with a frame shape surrounding the functional electrodes, a cover member on the support layer to seal an opening of the support layer, the cover member including a first main surface facing the support layer, and a second main surface opposite to the first main surface. Recesses are located in the cover member and are open to the second main surface. Via holes extend through the support layer and to bottom surfaces of the recesses of the cover member, the via holes each including an opening that is open to the bottom surface. The area of the opening of each of the via holes is not more than the area of the bottom surface of the corresponding recess of the cover member. First via conductor portions are provided in the via holes and second via conductor portions are provided in the recesses of the cover member.
Public/Granted literature
- US20170093366A1 ELASTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2017-03-30
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