Invention Grant
- Patent Title: Placement of component in circuit board intermediate product by flowable adhesive layer on carrier substrate
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Application No.: US15301371Application Date: 2015-04-01
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Publication No.: US10709023B2Publication Date: 2020-07-07
- Inventor: Gerald Weidinger , Timo Schwarz , Andreas Zluc
- Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Applicant Address: AT Leoben
- Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Current Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Current Assignee Address: AT Leoben
- Agency: Smith Tempel Blaha LLC
- Agent Robert A. Blaha
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5856d2a3
- International Application: PCT/EP2015/057216 WO 20150401
- International Announcement: WO2015/150474 WO 20151008
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H05K1/18 ; H01L23/00 ; H05K3/00 ; H05K3/46 ; H01L21/56 ; H05K3/10
Abstract:
A method of manufacturing a circuit board or a circuit board intermediate product, wherein the method comprises providing a carrier structure, applying a layer of flowable low-viscosity adhesive on the carrier structure over a surface area of the carrier structure which is larger than a mounting area in which an electronic component is to be mounted on the carrier structure, and pressing the electronic component into a subsection of the layer of adhesive in the mounting area so that at least part of the electronic component is immersed within the adhesive.
Public/Granted literature
Information query
