Invention Grant
- Patent Title: Printed circuit board mounting structure and display apparatus including the same
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Application No.: US16042861Application Date: 2018-07-23
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Publication No.: US10709026B2Publication Date: 2020-07-07
- Inventor: Song Hyeon Kim , Sung Soo Jung , Dae Sung Ko , Jun Pil Oh
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Staas & Halsey LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6548a4c4
- Main IPC: H05K5/00
- IPC: H05K5/00 ; G06F1/16 ; G06F1/18 ; H05K7/14
Abstract:
A Printed Circuit Board (PCB) mounting structure having an improved structure for improving assemblability of a product, and a display apparatus including the PCB mounting structure. The PCB mounting structure includes a mounting member provided on the PCB and a mounting portion provided on a chassis for mounting the PCB to the chassis without using screws.
Public/Granted literature
- US20180352665A1 PRINTED CIRCUIT BOARD MOUNTING STRUCTURE AND DISPLAY APPARATUS INCLUDING THE SAME Public/Granted day:2018-12-06
Information query
