Invention Grant
- Patent Title: Circuit board module and electronic device
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Application No.: US16144867Application Date: 2018-09-27
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Publication No.: US10709027B2Publication Date: 2020-07-07
- Inventor: Wen-Hsien Tsao , Ho-Ching Huang , Wen-Cheng Tsai
- Applicant: PEGATRON CORPORATION
- Applicant Address: TW Taipei
- Assignee: PEGATRON CORPORATION
- Current Assignee: PEGATRON CORPORATION
- Current Assignee Address: TW Taipei
- Agency: J.C. Patents
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2cea5bb4
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K5/00 ; H05K5/02 ; H05K5/06 ; H05K3/34

Abstract:
A circuit board module for being assembled to a case is provided. The circuit board module includes an electronic connector and a circuit board. The electronic connector is fixed to the circuit board. The circuit board has at least one first slot. The at least one first slot is configured for a fixing element to pass through and for the circuit board to be assembled to a case. The size of the at least one first slot allows the fixing element to move in a direction parallel to a surface of the circuit board in the at least one first slot. An electronic device having the circuit board module is also provided.
Public/Granted literature
- US20190159351A1 CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE Public/Granted day:2019-05-23
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