A high frequency module includes an insulating substrate, a mountable element, and a shield conductor. The mountable element is mounted to a surface of the insulating substrate and includes a first mounting terminal. The shield conductor covers the mountable element in a spaced relationship to the mountable element. An exposing portion in which at least the first terminal is exposed is provided in the shield conductor, and a linear distance from the first terminal to the exposing portion is shorter than a linear distance from the first terminal to the shield conductor.