A component mounting device head unit includes a head main body, a nozzle being provided on the head main body, a drive source, a cover, and a heat transfer member. The nozzle is configured to pick up a component. The drive source is configured to transfer moving power to at least one of the head main body and the nozzle. The cover covers the drive source. The heat transfer member connects the cover to the drive source or a frame of the drive source, and the heat transfer member is configured to allow heat generated by the drive source to escape to the cover.