• Patent Title: Mold platen, mold clamping device, injection molding device
  • Application No.: US16603030
    Application Date: 2017-10-06
  • Publication No.: US10710290B2
    Publication Date: 2020-07-14
  • Inventor: Naoki Kato
  • Applicant: U-MHI PLATECH CO., LTD.
  • Applicant Address: JP Nagoya-shi, Aichi
  • Assignee: U-MHI PLATECH CO., LTD.
  • Current Assignee: U-MHI PLATECH CO., LTD.
  • Current Assignee Address: JP Nagoya-shi, Aichi
  • Agent Manabu Kanesaka; Benjamin Hauptman; Kenneth Berner
  • International Application: PCT/JP2017/036488 WO 20171006
  • International Announcement: WO2019/069451 WO 20190411
  • Main IPC: B29C45/17
  • IPC: B29C45/17
Mold platen, mold clamping device, injection molding device
Abstract:
A mold platen includes a mold plate to which a mold is attached, a rear-surface plate provided opposite to the mold plate, coupling portions configured to be coupled to respective tie rods at four corners of the mold plate and the rear-surface plate, a cylindrical rib that is provided between the mold plate and the rear-surface plate and is located at a center part of the mold plate and the rear-surface plate, a diagonal reinforcing rib that is provided between the mold plate and the rear-surface plate and is configured to connect the cylindrical rib and each of the coupling portions, and a longitudinal/lateral reinforcing rib that is provided between the mold plate and the rear-surface plate and extends from the cylindrical rib along a position between the adjacent coupling portions.
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