Invention Grant
- Patent Title: Composite and multilayered silver films for joining electrical and mechanical components
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Application No.: US14915067Application Date: 2014-08-29
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Publication No.: US10710336B2Publication Date: 2020-07-14
- Inventor: Oscar Khaselev , Bin Mo , Monnir Boureghda , Michael T. Marczi , Bawa Singh
- Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
- Applicant Address: US CT Waterbury
- Assignee: Alpha Assembly Solutions Inc.
- Current Assignee: Alpha Assembly Solutions Inc.
- Current Assignee Address: US CT Waterbury
- Agency: Stinson LLP
- International Application: PCT/US2014/053489 WO 20140829
- International Announcement: WO2015/031801 WO 20150305
- Main IPC: B22F7/04
- IPC: B22F7/04 ; B32B15/01 ; B22F5/00 ; C22C32/00 ; C22C49/00 ; H01L23/00
Abstract:
Materials for die attachment such as silver sintering films may include reinforcing, modifying particles for enhanced performance. Methods for die attachment may involve the of such materials.
Public/Granted literature
- US20160207286A1 COMPOSITE AND MULTILAYERED SILVER FILMS FOR JOINING ELECTRICAL AND MECHANICAL COMPONENTS Public/Granted day:2016-07-21
Information query
