Invention Grant
- Patent Title: Resealable laminate for heat sealed packaging
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Application No.: US13637993Application Date: 2011-03-29
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Publication No.: US10710773B2Publication Date: 2020-07-14
- Inventor: Xinrong Duan , Martin Daffner , ZhiJian Xue
- Applicant: Xinrong Duan , Martin Daffner , ZhiJian Xue
- Applicant Address: US CA Glendale
- Assignee: Avery Dennison Corporation
- Current Assignee: Avery Dennison Corporation
- Current Assignee Address: US CA Glendale
- International Application: PCT/US2011/030246 WO 20110329
- International Announcement: WO2012/036765 WO 20120322
- Main IPC: B65D33/00
- IPC: B65D33/00 ; B65D33/24 ; B65D75/58

Abstract:
A resealable package assembly is described. The package assembly includes a selectively positionable flap that covers an aperture or enables access through the aperture into the package. The flap and package include provisions for releasably engaging the flap to the package to seal the interior of the package. Provisions for grasping the tab and indicating whether tampering has occurred are also described.
Public/Granted literature
- US20130177263A1 Resealable Laminate for Heat Sealed Packaging Public/Granted day:2013-07-11
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