Invention Grant
- Patent Title: Polyimide precursor resin composition
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Application No.: US15555779Application Date: 2016-03-08
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Publication No.: US10711105B2Publication Date: 2020-07-14
- Inventor: Yoshiki Miyamoto , Yasuhito Iizuka , Masaki Maitani , Takayuki Kanada
- Applicant: ASAHI KASEI KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: ASAHI KASEI KABUSHIKI KAISHA
- Current Assignee: ASAHI KASEI KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@10289fef
- International Application: PCT/JP2016/057194 WO 20160308
- International Announcement: WO2016/147958 WO 20160922
- Main IPC: C08G73/10
- IPC: C08G73/10 ; C08J5/18 ; C08L79/08 ; C09D179/08 ; C08K5/5415 ; C08L83/04 ; C08G77/46

Abstract:
This resin composition is characterized by comprising (a) 100 parts by mass of a polyimide precursor containing a structural unit represent by general formula (1) (wherein, R1 and R2 are each independently selected from a hydrogen atom, monovalent aliphatic hydrocarbons having 1-20 carbon atoms, and aromatic groups, and X1 is a tetravalent organic group having 4-32 carbon atoms), (b) 0.001-5 parts by mass of a silicone-based surfactant, and (c) an organic solvent.
Public/Granted literature
- US20180037698A1 POLYIMIDE PRECURSOR RESIN COMPOSITION Public/Granted day:2018-02-08
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