Invention Grant
- Patent Title: Removal of electroplating bath additives
-
Application No.: US15894643Application Date: 2018-02-12
-
Publication No.: US10711366B2Publication Date: 2020-07-14
- Inventor: Tighe A. Spurlin , Jonathan D. Reid
- Applicant: Lam Research Corporation
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: C25D21/18
- IPC: C25D21/18 ; B01D36/00 ; C25D21/06 ; B01D15/10 ; C25D7/12 ; C25D3/12 ; C25D3/38 ; B01D15/00

Abstract:
In one example, an electroplating system comprising a bath reservoir having a first inlet for feeding fresh electrolyte solution into the bath reservoir and a first outlet for bleeding used electrolyte solution out of the bath reservoir, a second inlet for receiving recycled electrolyte solution into the bath reservoir, and a second outlet for discharge of electrolyte solution from the bath reservoir. A plating cell is providing for electroplating an object, the plating cell has an inlet in direct or indirect fluid communication with the bath reservoir, and an outlet for discharge of electrolyte solution from the plating cell. An extraction column extracts by-products generated by the plating cell and has an inlet in direct or indirect fluid communication with the outlet of the plating cell, and an outlet for discharge of electrolyte solution from the extraction column. A first particle filter is disposed in a fluid pathway between the second outlet of the bath reservoir and the inlet of the plating cell, and a second particle filter is disposed in a fluid pathway between the outlet of the extraction column and the second inlet of the bath reservoir.
Public/Granted literature
- US20190203375A1 REMOVAL OF ELECTROPLATING BATH ADDITIVES Public/Granted day:2019-07-04
Information query