Invention Grant
- Patent Title: Mask blank, transfer mask, method for manufacturing transfer mask, and method for manufacturing semiconductor device
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Application No.: US16317204Application Date: 2017-06-22
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Publication No.: US10712655B2Publication Date: 2020-07-14
- Inventor: Hiroaki Shishido , Yasutaka Horigome
- Applicant: HOYA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: HOYA CORPORATION
- Current Assignee: HOYA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@27a3bf9b
- International Application: PCT/JP2017/022984 WO 20170622
- International Announcement: WO2018/020913 WO 20180201
- Main IPC: G03F1/58
- IPC: G03F1/58 ; G03F1/22 ; G03F1/78 ; G03F7/20 ; H01L21/311

Abstract:
This mask blank is provided with a light blocking film on a light transmitting substrate. The light blocking film has an optical density of 2.5 or more with respect to ArF excimer laser exposure light, and has a structure that comprises three or more multilayer structures, each of which is composed of a high nitride layer and a low nitride layer. The high nitride layer and the low nitride layer are formed from a material that is composed of silicon and nitrogen or a material that contains one or more elements selected from among semimetal elements and non-metal elements in addition to silicon and nitrogen. The high nitride layer has a nitrogen content of 50 atom % or more, and has a thickness of 10 nm or more. The low nitride layer has a nitrogen content of less than 50 atom %, and has a thickness that is not less than twice the thickness of the high nitride layer.
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