Embodiments of the disclosure relate, generally, to touch panel security, and more specifically, to using one or more security features present at one or more electrodes of a sensor module of a touch panel. Embodiments of security features may affect the capacitive coupling at a node of a sensor in a manner detectable by a microcontroller or other logic circuitry, and the location of the security features may provide a basis for an identifier usable to identify a touch panel to a host device with which the touch panel attempts to communicate.