Invention Grant
- Patent Title: Configuring signal devices in thermal processing systems
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Application No.: US16425197Application Date: 2019-05-29
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Publication No.: US10713448B2Publication Date: 2020-07-14
- Inventor: Michael Hoffa , E. Michael Shipulski
- Applicant: Hypertherm, Inc.
- Applicant Address: US NH Hanover
- Assignee: Hypertherm, Inc.
- Current Assignee: Hypertherm, Inc.
- Current Assignee Address: US NH Hanover
- Agency: Proskauer Rose LLP
- Main IPC: B23K10/02
- IPC: B23K10/02 ; G06K7/10 ; B23K26/21 ; B23K5/00 ; B23K7/10 ; B23K10/00 ; B24C1/04 ; B23K26/38 ; B26F3/00 ; H05H1/34 ; G05B19/18 ; B26D5/00 ; B23K101/18 ; B23K103/04

Abstract:
In some aspects, material processing head can include a body; an antenna disposed within the body; a first tag, associated with a first consumable component, disposed within a flux communication zone of the body at a first distance from the antenna, the first tag having a first resonant frequency; and a second tag, associated with a second consumable component, disposed within the flux communication zone of the body at a second distance from the antenna, the second tag having a second resonant frequency that is different than the first resonant frequency, where the first and second resonant frequencies are tuned based upon at least one of: i) a difference between the first distance and the second distance; or ii) a characteristic (e.g., shape) of the flux communication zone in which the first tag and/or the second tag is disposed.
Public/Granted literature
- US20190303629A1 Configuring Signal Devices in Thermal Processing Systems Public/Granted day:2019-10-03
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