Invention Grant
- Patent Title: Coil component
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Application No.: US15719286Application Date: 2017-09-28
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Publication No.: US10714253B2Publication Date: 2020-07-14
- Inventor: Sang Kyun Kwon , Jong Ho Chung
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5b5b72c5
- Main IPC: H01F3/08
- IPC: H01F3/08 ; H01F27/255 ; H01F27/29 ; H01F3/10 ; H01F1/153

Abstract:
A coil component includes a body having a coil part embedded therein, and an external electrode connected to the coil part. The body contains a plurality of first magnetic particles and a plurality of second magnetic particles, the second magnetic particles being smaller than the first magnetic particles, and the pluralities of first and second magnetic particles are dispersed in a main insulating portion. The plurality of second magnetic particles are dispersed in each of a plurality of sub-insulating portions to constitute composites, and a volume percentage of the second magnetic particles in the composites is 80% to 90%.
Public/Granted literature
- US20180268983A1 COIL COMPONENT Public/Granted day:2018-09-20
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