Invention Grant
- Patent Title: Multi-layered substrate manufacturing method
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Application No.: US13761348Application Date: 2013-02-07
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Publication No.: US10714351B2Publication Date: 2020-07-14
- Inventor: Hidehiro Maeda , Satoshi Katagiri
- Applicant: Hidehiro Maeda , Satoshi Katagiri
- Applicant Address: JP Tokyo
- Assignee: Nikon Corporation
- Current Assignee: Nikon Corporation
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@17f4538f com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@f3bc3e8 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@57b696bb
- Main IPC: H01L21/30
- IPC: H01L21/30 ; H05K3/00 ; H05K3/46 ; H05K13/00 ; H05K3/38 ; H05K3/32 ; H01L21/20 ; H01L21/683 ; H01L21/67 ; B32B38/18 ; B32B7/12 ; B32B37/10
Abstract:
Provided is a substrate holding unit that holds a pair of substrates that are aligned and layered, comprising a first holding member that holds one of the substrates; a plurality of members to be joined that are connected to the first holding member; a second holding member that holds the other of the substrates to face the one of the substrates; a plurality of joining members that exert an adhesion force on the members to be joined and are connected to the second holding member at positions corresponding to positions of the members to be joined; and an adhesion restricting section that restricts the adhesion force until the substrates are aligned.
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Information query
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