Invention Grant
- Patent Title: Substrate processing apparatus and method of manufacturing semiconductor device
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Application No.: US16354864Application Date: 2019-03-15
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Publication No.: US10714362B2Publication Date: 2020-07-14
- Inventor: Shuhei Saido
- Applicant: KOKUSAI ELECTRIC CORPORATION
- Applicant Address: JP Tokyo
- Assignee: KOKUSAI ELECTRIC CORPORATION
- Current Assignee: KOKUSAI ELECTRIC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Volpe and Koenig, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@8c9dfbd com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6c3b12
- Main IPC: H01L21/67
- IPC: H01L21/67 ; C23C16/52 ; H01L21/673 ; H01L21/02 ; C23C16/44 ; H01L21/687

Abstract:
Wafer processing with no dummies is sets forth, wherein an apparatus includes: a boat that hold a product substrates in array at all of positions where substrates may be held; a tubular reactor that houses the boat; a furnace surrounding an upper side and a lateral side of the reactor; a heater provided in the furnace and adapted to heat a side portion of the reactor; a ceiling heater provided in the furnace and adapted to heat a ceiling of the reactor; and a cap heater provided inside the reactor and below the boat; a gas supply mechanism individually supplying a gas to a top side of each of the product substrates.
Public/Granted literature
- US20190287829A1 SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2019-09-19
Information query
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