Embodiments relate to placing of semiconductor devices on a target substrate using a pick and place head (PPH) having a cross-section of a polygon shape and pick-up surfaces. The pick-up surfaces of the PPH are aligned with a carrier substrate mounted with the semiconductor devices, which may be light emitting diodes (LEDs). The PPH is moved toward one or more first semiconductor devices on the carrier substrate to pick up the one or more first semiconductor devices with a first pick-up surface of the PPH. The PPH is rotated to pick up one or more semiconductor devices dies with a second pick-up surface of the PPH. The one or more first semiconductor devices attached to the first pick-up surface and the one or more second semiconductor devices attached to the second pick-up surface are placed on a target substrate.