Invention Grant
- Patent Title: Liquid processing apparatus
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Application No.: US15775864Application Date: 2016-11-02
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Publication No.: US10714365B2Publication Date: 2020-07-14
- Inventor: Tetsurou Iriyama , Shinichi Umeno , Yasuhiro Takaki , Takami Satoh
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Amin, Turocy & Watson, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@30ab1c01
- International Application: PCT/JP2016/082547 WO 20161102
- International Announcement: WO2017/086158 WO 20170526
- Main IPC: H01L21/304
- IPC: H01L21/304 ; H01L21/67

Abstract:
A liquid processing apparatus includes a processing unit, a first supply route, a first device, a second supply route, a second device, a housing, and an external housing. The processing unit processes a substrate by using processing liquid including first and second processing liquids. The first supply route is for supplying the first processing liquid to the processing unit. The first device is for supplying the first processing liquid to the first supply route. The second supply route is for supplying the second processing liquid to the processing unit. The second processing liquid has higher temperature than the first processing liquid. The second device is for supplying the second processing liquid to the second supply route. The housing accommodates the processing unit. The external housing accommodates the first and second devices, and is adjacent to the housing. The external housing includes a partition wall between the first and second devices.
Public/Granted literature
- US20180330974A1 LIQUID PROCESSING APPARATUS Public/Granted day:2018-11-15
Information query
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