The present application provides a fan-out antenna packaging structure and a method making the same. The method comprises: providing a carrier and forming a release layer on an upper surface of the carrier; forming a chip structure on an upper surface of the release layer, the chip structure comprises an unpacked chip and a contact pad disposed on and electrically connected to the unpacked chip; forming a plastic packaging layer packaging the chip structure on the upper surface of the release layer; removing the carrier and the release layer to expose the contact pad; forming a single-layer antenna structure and forming a redistribution layer on the surface where the contact pad is disposed; forming an under-bump metal layer on an upper surface of the redistribution layer; and forming a solder ball bump on an upper surface of the under-bump metal layer.