- Patent Title: Semiconductor device and semiconductor device manufacturing method
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Application No.: US16030088Application Date: 2018-07-09
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Publication No.: US10714443B2Publication Date: 2020-07-14
- Inventor: Hirokazu Saito
- Applicant: LAPIS SEMICONDUCTOR CO., LTD.
- Applicant Address: JP Yokohama
- Assignee: LAPIS SEMICONDUCTOR CO., LTD.
- Current Assignee: LAPIS SEMICONDUCTOR CO., LTD.
- Current Assignee Address: JP Yokohama
- Agency: Volentine, Whitt & Francos, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4e605b48
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/00 ; H01L21/683 ; H01L23/58

Abstract:
A semiconductor device including: a substrate including, in a central portion the substrate, n first element formation regions having a rectangular shape and arrayed along a first direction, and n+m second element formation regions arrayed along the first direction adjacent to the first element formation regions; plural projecting electrodes formed at each of the first and the second element formation regions; and plural dummy projecting electrodes formed, at a peripheral portion, overlapping a triangle defined by a first edge of the first element formation region that forms a boundary between the first element formation region and the peripheral portion, and a second edge of the second element formation region that is adjacent to a corner of the first edge and that forms a boundary between the second element formation region and the peripheral portion.
Public/Granted literature
- US20180315726A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD Public/Granted day:2018-11-01
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