Invention Grant
- Patent Title: Apparatus with multi-wafer based device comprising embedded active and/or passive devices and method for forming such
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Application No.: US16473817Application Date: 2017-03-30
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Publication No.: US10714446B2Publication Date: 2020-07-14
- Inventor: Anup Pancholi , Prashant Majhi , Paul Fischer , Patrick Morrow
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Green, Howard & Mughal LLP
- International Application: PCT/US2017/025177 WO 20170330
- International Announcement: WO2018/182647 WO 20181004
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L25/16 ; H01L23/522
Abstract:
An apparatus is provided which comprises: a substrate; a first active device adjacent to the substrate; a first set of one or more layers to interconnect with the first active device; a second set of one or more layers; a second active and/or passive device coupled to the second set of one or more layers; and a layer adjacent to one of the layers of the first and second sets, wherein the layer is to bond the one of the layers of the first and second sets.
Information query
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