Invention Grant
- Patent Title: Electrode terminal, semiconductor device, and power conversion apparatus
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Application No.: US15286771Application Date: 2016-10-06
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Publication No.: US10714447B2Publication Date: 2020-07-14
- Inventor: Rei Yoneyama , Yoshitaka Kimura , Akihiko Yamashita
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1452b5c6
- Main IPC: H01L23/053
- IPC: H01L23/053 ; H01L23/055 ; H01L23/00 ; H01L23/04 ; H01L25/07
Abstract:
An electrode terminal includes a body and a first bonding part. The body includes a first metal material. Then, the first bonding part is bonded to one end of the body, and includes a second metal material which is a clad material other than the first metal material. The first bonding part is ultrasonically bondable to a first bonded member. An elastic part which is elastically deformable is provided between the one end of the body and the other end of the body.
Public/Granted literature
- US20170221853A1 ELECTRODE TERMINAL, SEMICONDUCTOR DEVICE, AND POWER CONVERSION APPARATUS Public/Granted day:2017-08-03
Information query
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