Invention Grant
- Patent Title: SRAM structure
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Application No.: US15953818Application Date: 2018-04-16
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Publication No.: US10714484B2Publication Date: 2020-07-14
- Inventor: Feng-Ming Chang , Chia-Hao Pao , Lien-Jung Hung , Ping-Wei Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L27/11
- IPC: H01L27/11 ; H01L27/02 ; H01L29/06 ; G11C11/417 ; G11C11/412

Abstract:
An SRAM structure is provided. The SRAM structure includes a plurality of first well regions with a first doping type, a plurality of second well regions with a second doping type, a third well region with the second doping type, a plurality of first well pick-up regions, a plurality of second well pick-up regions, and a plurality of memory cells. The first well regions, the second well regions, and the third well region are formed in a semiconductor substrate. The third well region is adjacent to the second well regions. The first well pick-up regions are formed in the first well regions. The second well pick-up regions are formed in the third well region. The second well pick-up regions are shared by the third well region and the second well regions. The memory cells are formed on the first and second well regions.
Public/Granted literature
- US20190164978A1 SRAM STRUCTURE Public/Granted day:2019-05-30
Information query
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