Invention Grant
- Patent Title: Semiconductor device and manufacturing method of a semiconductor device
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Application No.: US16234283Application Date: 2018-12-27
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Publication No.: US10714487B2Publication Date: 2020-07-14
- Inventor: Yi-Jing Lee , Tsz-Mei Kwok , Ming-Hua Yu , Kun-Mu Li
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L27/11
- IPC: H01L27/11 ; H01L27/02 ; H01L29/78 ; H01L21/8238 ; H01L27/092 ; H01L29/06 ; H01L29/08 ; H01L29/165

Abstract:
A semiconductor device includes a transistor, an isolation structure, and a fin sidewall structure. The transistor includes a fin extending from a substrate and an epitaxy structure grown on the fin. The isolation structure is above the substrate. The fin sidewall structure is above the isolation structure and is on a sidewall of the epitaxy structure. A method for manufacturing the semiconductor device is also disclosed.
Public/Granted literature
- US20190131310A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE Public/Granted day:2019-05-02
Information query
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