Invention Grant
- Patent Title: Semiconductor device
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Application No.: US15366418Application Date: 2016-12-01
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Publication No.: US10714502B2Publication Date: 2020-07-14
- Inventor: Shunpei Yamazaki , Kiyoshi Kato , Masayuki Sakakura
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP
- Agency: Husch Blackwell LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3c6a367e
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/786 ; H01L27/108

Abstract:
A semiconductor device that is suitable for miniaturization and higher density is provided. A semiconductor device includes a first transistor over a semiconductor substrate, a second transistor including an oxide semiconductor over the first transistor, and a capacitor over the second transistor. The capacitor includes a first conductor, a second conductor, and an insulator. The second conductor covers a side surface of the first conductor with an insulator provided therebetween.
Public/Granted literature
- US20170162603A1 Semiconductor Device Public/Granted day:2017-06-08
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