Invention Grant
- Patent Title: Isolation structure and image sensor
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Application No.: US16222649Application Date: 2018-12-17
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Publication No.: US10714523B2Publication Date: 2020-07-14
- Inventor: Yun-Wei Cheng , Chun-Wei Chia , Chun-Hao Chou , Kuo-Cheng Lee , Hsun-Ying Huang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
An optical isolation structure and a method for fabricating the same are provided. The optical isolation structure includes a first dielectric layer, a second dielectric layer, a third dielectric layer and a dielectric post. The first dielectric layer includes a trench portion located in a trench of the semiconductor substrate. The second dielectric layer includes a trench portion covering the trench portion of the first dielectric layer and located in the trench of the semiconductor substrate. The third dielectric layer includes a trench portion covering the trench portion of the second dielectric layer and located in the trench of the semiconductor substrate. The dielectric post is disposed in the trench of the semiconductor substrate and covering the trench portion of the third dielectric layer.
Public/Granted literature
- US20190139998A1 ISOLATION STRUCTURE AND IMAGE SENSOR Public/Granted day:2019-05-09
Information query
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