Invention Grant
- Patent Title: Method of manufacturing light emitting device
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Application No.: US15909877Application Date: 2018-03-01
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Publication No.: US10714663B2Publication Date: 2020-07-14
- Inventor: Daisuke Sato , Atsushi Hashizume , Toshiki Nishihama , Shimpei Maeda
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Agency: Mori & Ward, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7689bf60
- Main IPC: H01L33/50
- IPC: H01L33/50 ; H01L33/60 ; H01L33/58 ; H01L25/16 ; H01L33/52

Abstract:
A method of manufacturing a light emitting device, includes providing a light emitting element having an element upper surface, an element lower surface opposite to the element upper surface in a thickness direction of the light emitting element, and an element side surface between the element upper surface and the element lower surface. A wavelength converter having a converter lower surface is provided. The wavelength converter is joined to the light emitting element using an adhesive so that the converter lower surface faces the element upper surface. The converter lower surface has an exposed region that does not face the element upper surface viewed along the thickness direction. The adhesive covers the element side surface and the exposed region.
Public/Granted literature
- US20180198038A1 METHOD OF MANUFACTURING LIGHT EMITTING DEVICE Public/Granted day:2018-07-12
Information query
IPC分类: