Invention Grant
- Patent Title: Light-emitting device and manufacturing method thereof
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Application No.: US16278731Application Date: 2019-02-19
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Publication No.: US10714668B2Publication Date: 2020-07-14
- Inventor: Ming-Hsien Lee , Yi-Cheng Lin , Chuang-Cheng Yang , Kai-Wei Hong , Chun-Feng Lin
- Applicant: Au Optronics Corporation
- Applicant Address: TW Hsinchu
- Assignee: Au Optronics Corporation
- Current Assignee: Au Optronics Corporation
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1ba7cd54
- Main IPC: H01L25/075
- IPC: H01L25/075 ; H01L33/62 ; H01L27/12

Abstract:
A light-emitting device includes a substrate, a circuit array including a plurality of circuit units disposed on the substrate, a first conductive pattern, a second conductive pattern, a first wire pattern, and a second wire pattern disposed on the circuit array, and a light-emitting element disposed on one of the circuit units. The light-emitting element includes a first electrode and a second electrode respectively electrically connected to the first conductive pattern and the second conductive pattern. The second electrode is not overlapped with the first wire pattern and the second wire pattern. A manufacturing method of the light-emitting device is also provided.
Public/Granted literature
- US20200028044A1 LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2020-01-23
Information query
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