Invention Grant
- Patent Title: Wireless module and method for manufacturing wireless module
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Application No.: US15828178Application Date: 2017-11-30
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Publication No.: US10714822B2Publication Date: 2020-07-14
- Inventor: Jin Mikata , Masaya Shimamura , Mikio Aoki , Takehiko Kai , Taiji Ito
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@61cd5bda
- Main IPC: H01Q1/38
- IPC: H01Q1/38 ; H01L23/31 ; H01Q1/22 ; H01Q9/42 ; H01Q1/52 ; H01L23/552 ; H01L21/56 ; B32B15/08 ; H01Q23/00
Abstract:
A wireless module, including: a substrate; an electronic circuit mounted in a first region on a one face of the substrate; a conductive pattern formed in a second region on another face of the substrate and serving as an antenna; a resin layer sealing the electronic circuit in the first region; and a shielding layer formed on a surface of the resin layer and having conductivity.
Public/Granted literature
- US20180159209A1 WIRELESS MODULE AND METHOD FOR MANUFACTURING WIRELESS MODULE Public/Granted day:2018-06-07
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