Invention Grant
- Patent Title: Antenna and an antenna packaging structure
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Application No.: US15726348Application Date: 2017-10-05
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Publication No.: US10714835B2Publication Date: 2020-07-14
- Inventor: Bin Yu , Qingfang Li , Yanmei Shi
- Applicant: SPEED WIRELESS TECHNOLOGY INC.
- Applicant Address: US CA Cupertino CN Guangdong
- Assignee: SPEEDLINK TECHNOLOGY INC.,HUIZHOU SPEED WIRELESS TECHNOLOGY CO., LTD
- Current Assignee: SPEEDLINK TECHNOLOGY INC.,HUIZHOU SPEED WIRELESS TECHNOLOGY CO., LTD
- Current Assignee Address: US CA Cupertino CN Guangdong
- Agency: Womble Bond Dickinson (US) LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@a45af0b
- Main IPC: H01Q1/48
- IPC: H01Q1/48 ; H01Q13/10 ; H01Q1/50 ; H01Q13/18 ; H01Q19/09 ; H01Q15/00 ; H01P3/08 ; H01P3/02

Abstract:
An antenna element includes an antenna radiator, an antenna dielectric substrate, a grounded metal plate, and a feed structure. The antenna radiator consists of several metal sheet units. The coupled slots between the adjacent metal sheet units form radiation slots and the grounded metal plate has a feed slot which is fed by the feed structure and the radiation slot is fed by the feed slot through coupling. This disclosure also provides an antenna packaging structure. An EBG is deployed as part of the radiator to improve the problems of high profile and narrow bandwidth of the traditional antennas. The EBG radiator also achieves low profile, broadband and high gain characteristics that is very suitable for millimeter wave band AiP and is also suitable for mass production at low cost, and therefore it can be widely used in 60 GHz WiFi system and a 5G millimeter wave communication system.
Public/Granted literature
- US20180342810A1 ANTENNA AND AN ANTENNA PACKAGING STRUCTURE Public/Granted day:2018-11-29
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