Invention Grant
- Patent Title: Electronic component and substrate
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Application No.: US16264881Application Date: 2019-02-01
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Publication No.: US10714849B2Publication Date: 2020-07-14
- Inventor: Takahide Mukoyama , Tetsuro Yamada , Mitsuhiko Sugane , Yoshiyuki Hiroshima , Kohei Choraku , Kazuki Takahashi , Akiko Matsui , Shigeo Iriguchi
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4545e780
- Main IPC: H01R12/58
- IPC: H01R12/58 ; H01R12/73 ; H01R12/72 ; H01R12/71

Abstract:
An electronic component includes: a first terminal that is inserted into a first through hole in a substrate; and a second terminal that is inserted into a second through hole in the substrate, wherein a length of the first terminal from a first end that is inserted into the first through hole to a second end is longer than a length of the second terminal from a third end that is inserted into the second through hole to a fourth end, and a cross sectional area of a portion of the first terminal positioned on a side of the second end with respect to a first joined portion is larger than a cross sectional area of a portion of the second terminal positioned on a side of the fourth end with respect to a second joined portion.
Public/Granted literature
- US20190245284A1 ELECTRONIC COMPONENT AND SUBSTRATE Public/Granted day:2019-08-08
Information query
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