Invention Grant
- Patent Title: Apparatus and method for frequency quintupling
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Application No.: US16699232Application Date: 2019-11-29
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Publication No.: US10715038B1Publication Date: 2020-07-14
- Inventor: Chia-Liang (Leon) Lin
- Applicant: Realtek Semiconductor Corp.
- Applicant Address: TW Hsinchu
- Assignee: REALTEK SEMICONDUCTOR CORP.
- Current Assignee: REALTEK SEMICONDUCTOR CORP.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H02M3/07
- IPC: H02M3/07 ; H03L7/099

Abstract:
A circuit includes a first TSCP (tri-stage charge pump), a second TSCP, a third TSCP, a fourth TSCP, a fifth TSCP, and a load. The first TSCP receives a first phase and a third phase of a five-phase clock and outputs a first current to an output node. The second TSCP receives a second phase and a fourth phase of the five-phase clock and outputs a second current to the output node. The third TSCP receives a third phase and a fifth phase of the five-phase clock and outputs a third current to the output node. The fourth TSCP receives a fourth phase and the first phase of the five-phase clock and outputs a fourth current to the output node. The fifth TSCP receives a fifth phase and the second phase of the five-phase clock and outputs a fifth current to the output node. The load terminates the output node.
Information query
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