Invention Grant
- Patent Title: Acoustic resonator package
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Application No.: US16271158Application Date: 2019-02-08
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Publication No.: US10715098B2Publication Date: 2020-07-14
- Inventor: Tae Kyung Lee , Kwang Su Kim , Jin Suk Son , Yeong Gyu Lee , Sung Sun Kim , Sang Jin Kim
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@553ed8ac
- Main IPC: H03H9/02
- IPC: H03H9/02 ; H03H9/15 ; H03H9/54
Abstract:
An acoustic resonator package includes: a substrate; an acoustic resonator disposed on the substrate; a cap disposed on the substrate and the acoustic resonator; and a bonding portion bonding the substrate and the cap to each other, wherein the cap includes a trench formed around the bonding portion and a protective layer covering a surface of the trench in the cap, and wherein a portion of the bonding portion fills at least a portion of the trench.
Public/Granted literature
- US20200021265A1 ACOUSTIC RESONATOR PACKAGE Public/Granted day:2020-01-16
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