- Patent Title: Bulk acoustic wave resonator and method for manufacturing the same
-
Application No.: US15704225Application Date: 2017-09-14
-
Publication No.: US10715099B2Publication Date: 2020-07-14
- Inventor: Je Hong Kyoung , Jin Suk Son , Hwa Sun Lee , Sang Hyun Yi
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@24727b0 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2076f29c
- Main IPC: H03H9/02
- IPC: H03H9/02 ; H03H9/17 ; H03H3/02 ; H03H3/04

Abstract:
A bulk acoustic wave resonator includes a substrate protective layer disposed on a top surface of a substrate, a cavity defined by a membrane layer and the substrate, and a resonating part disposed on the membrane layer. The membrane layer includes a first layer and a second layer, the second layer having the same material as the first layer and having a density greater than that of the first layer.
Public/Granted literature
- US20180123554A1 BULK ACOUSTIC WAVE RESONATOR AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2018-05-03
Information query