Invention Grant
- Patent Title: Ultrasound transducer assembly
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Application No.: US15256029Application Date: 2016-09-02
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Publication No.: US10716542B2Publication Date: 2020-07-21
- Inventor: Wei Li , Gregg Frey , Simon Hsu
- Applicant: FUJIFILM SonoSite, Inc.
- Applicant Address: US WA Bothell
- Assignee: FUJIFILM SONOSITE, INC.
- Current Assignee: FUJIFILM SONOSITE, INC.
- Current Assignee Address: US WA Bothell
- Agency: Womble Bond Dickinson (US) LLP
- Main IPC: H01L41/312
- IPC: H01L41/312 ; H01L41/338 ; A61B8/00 ; H01L41/09 ; G01N29/24 ; B06B1/06 ; B60B1/06

Abstract:
Ultrasound transducer assemblies and associated systems and method are disclosed herein. In one embodiment, an ultrasound transducer assembly includes at least one matching layer overlies a transducer layer. A plurality of kerfs extends at least into the matching layer. In some aspects, the kerfs are at least partially filled with a filler material that includes microballoons and/or microspheres.
Public/Granted literature
- US20170065253A1 ULTRASOUND TRANSDUCER ASSEMBLY Public/Granted day:2017-03-09
Information query
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