Invention Grant
- Patent Title: System for laser material processing and method for adjusting the size and position of a laser focus
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Application No.: US15576408Application Date: 2016-05-17
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Publication No.: US10717152B2Publication Date: 2020-07-21
- Inventor: Martin Valentin , Martin Becker , Sebastian Thunich
- Applicant: Scanlab GmbH
- Applicant Address: DE Puchheim
- Assignee: SCANLAB GmbH
- Current Assignee: SCANLAB GmbH
- Current Assignee Address: DE Puchheim
- Agency: Cahn & Samuels, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@27db7136
- International Application: PCT/EP2016/061036 WO 20160517
- International Announcement: WO2016/188803 WO 20161201
- Main IPC: B23K26/046
- IPC: B23K26/046 ; G02B27/09 ; G02B19/00 ; B23K26/06 ; G02B17/00 ; G02B26/10 ; G02B27/30 ; G02B27/14

Abstract:
The invention relates to a laser material processing system comprising a collimation optic (K) having a total collimation focal length (fK), consisting of: a beam supply (Z) for divergent beams (D); a first and second optical device (Ll, L2) having a positive or negative focal length (fl, f2), wherein the divergent beams (D) first pass through the first optical device (Ll) and subsequently pass through the second optical device (L2), and leave the second optical device (L2) in a collimated state; a third optical device (0) arranged downstream of the collimation optic (K) and having a positive focal length (fO) that focuses the beams (P) leaving the collimation optic (K) in a collimated state to a focus (F); a first and second adjusting element (Al, A2) for independently moving the first or the second optical device (LI, L2) away from one another along a beam propagation direction (R), wherein a total beam path (gs) between the beam supply (Z) and an image-side focal plane (B) of the third optical device (0) is smaller that twice the sum of the positive focal length (fO) of the third optical device (0) and the total collimation focal length (fK).
Public/Granted literature
- US20180154481A1 System for Laser Material Processing and Method for Adjusting the Size and Position of a Laser Focus Public/Granted day:2018-06-07
Information query
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