Invention Grant
- Patent Title: Material sets
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Application No.: US16073278Application Date: 2016-05-13
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Publication No.: US10717232B2Publication Date: 2020-07-21
- Inventor: Yi Feng , Erica Montei Fung , Michael A. Novick
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HPI Patent Department
- International Application: PCT/US2016/032264 WO 20160513
- International Announcement: WO2017/196358 WO 20171116
- Main IPC: B29C64/165
- IPC: B29C64/165 ; B33Y70/00 ; B29C64/20 ; B33Y10/00 ; C08K3/04 ; B33Y30/00 ; B33Y80/00 ; B29C64/357 ; B29K77/00 ; B29K105/00

Abstract:
The present disclosure is drawn to material sets for 3-dimensional printing, 3-dimensional printing systems, and 3-dimensional printed parts. A material set can include a polyamide polymer powder having an average particle size from 20 μm to 120 μm and a fusing agent. The polyamide-11 can have a solution viscosity from 1.5 to 1.75 at room temperature, and may increase by no more than 5% after exposure to 180° C. for 20 hours. The fusing agent can include an energy absorber capable of absorbing electromagnetic radiation to produce heat.
Public/Granted literature
- US20190030802A1 MATERIAL SETS Public/Granted day:2019-01-31
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