An intentionally activated frangible bonding system comprises a frangible adhesive, adhesive primer, composite material matrix, and/or the like, having a polydispersion of at least one additive spread throughout the frangible bonding material. The additive degrades a bond provided by the frangible bonding material, upon application of a specific energy to the frangible bonding material. An energy emitter is configured to selectively direct the specific energy toward a structure or assembly comprising components bonded by the frangible bonding material to degrade the frangible bonding material bonding the components for disassembly.