Invention Grant
- Patent Title: Flow path structure, liquid ejecting head, and liquid ejecting apparatus
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Application No.: US16728277Application Date: 2019-12-27
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Publication No.: US10717277B2Publication Date: 2020-07-21
- Inventor: Isamu Togashi , Hiroaki Okui , Yasuyuki Kudo , Fujio Akahane
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2605580f com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2c63dcfc
- Main IPC: B41J2/14
- IPC: B41J2/14

Abstract:
A flow path structure includes: a substrate that includes a first surface and a second surface on a side opposite to the first surface; a supply port formed on the first surface; a plurality of discharge ports formed on the second surface; grooves that are formed on the first surface so as to extend in an X direction and communicate with the supply ports and with the plurality of discharge ports via through-holes formed on the substrate; and a sealing portion that is disposed on the first surface and seals each groove.
Public/Granted literature
- US20200139710A1 FLOW PATH STRUCTURE, LIQUID EJECTING HEAD, AND LIQUID EJECTING APPARATUS Public/Granted day:2020-05-07
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