Disclosed herein is an epoxy resin compositions comprising an epoxy component and a curing agent component, wherein the curing agent component is at least an aminoalkylimidazole curing agent, and wherein the epoxy component and the curing agent component react together at a temperature of about 100° C. to about 130° C. to form a substantially cured reaction product in about 10 minutes or less. Further disclosed are composite products formed from such epoxy resin compositions.