Invention Grant
- Patent Title: Resin composition and prepreg, resin sheet, laminate, and printed circuit board comprising same
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Application No.: US15738834Application Date: 2016-07-04
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Publication No.: US10717837B2Publication Date: 2020-07-21
- Inventor: Katsuya Tomizawa , Eisuke Shiga , Meguru Ito , Tomo Chiba
- Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4478983a
- International Application: PCT/JP2016/069750 WO 20160704
- International Announcement: WO2017/006895 WO 20170112
- Main IPC: C08J5/24
- IPC: C08J5/24 ; C08K3/00 ; C08L79/04 ; C08L57/00 ; C08L35/00 ; C08K5/3465 ; H05K1/03 ; B32B5/02 ; B32B15/14 ; C08K5/3447 ; C08L65/02 ; H01L23/14 ; H01L23/00
Abstract:
The present invention provides a resin composition containing an alkenyl-substituted nadimide and a perinone-based colorant, wherein the content of the perinone-based colorant is 0.8 parts by mass or less based on 100 parts by mass in total of resin-constituting components in the resin composition.
Public/Granted literature
- US20180179354A1 RESIN COMPOSITION AND PREPREG, RESIN SHEET, LAMINATE, AND PRINTED CIRCUIT BOARD COMPRISING SAME Public/Granted day:2018-06-28
Information query
