Invention Grant
- Patent Title: Polishing composition, method for producing polishing composition and polishing composition preparation kit
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Application No.: US16185666Application Date: 2018-11-09
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Publication No.: US10717899B2Publication Date: 2020-07-21
- Inventor: Kohsuke Tsuchiya , Hisanori Tansho , Taiki Ichitsubo
- Applicant: FUJIMI INCORPORATED
- Applicant Address: JP Kiyosu-Shi
- Assignee: FUJIMI INCORPORATED
- Current Assignee: FUJIMI INCORPORATED
- Current Assignee Address: JP Kiyosu-Shi
- Agency: Foley & Lardner LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@152dd55f com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5681b9ee com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@cbecaf3 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@16e6352a
- Main IPC: C09G1/02
- IPC: C09G1/02 ; H01L21/306 ; C08F216/06 ; H01L21/02 ; C08L29/04
Abstract:
Provided are polishing compositions comprising a water-soluble polymer and water. The water-soluble polymer of an embodiment has a repeat unit that does not have any hydroxyl groups, and the water-soluble polymer has a hydroxyl group content in a range of 4 mmol/g or higher and 21 mmol/g or lower. The water-soluble polymer of another embodiment has a repeat unit A that has a hydroxyl group and a repeat unit B, and the number of moles of the repeat unit B in the total number of moles of all the repeat units of the water-soluble polymer is 5% or greater.
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