• Patent Title: Optical fiber array with high reliability
  • Application No.: US16310823
    Application Date: 2017-10-26
  • Publication No.: US10718908B2
    Publication Date: 2020-07-21
  • Inventor: Kaifa Yang
  • Applicant: SENKO ADVANCED COMPONENTS, INC.
  • Applicant Address: US MA Marlborough
  • Assignee: Senko Advanced Components, Inc
  • Current Assignee: Senko Advanced Components, Inc
  • Current Assignee Address: US MA Marlborough
  • Agent Edward S. Jarmolowicz, Esq.
  • Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6aaf7355
  • International Application: PCT/CN2017/107799 WO 20171026
  • International Announcement: WO2018/077211 WO 20180503
  • Main IPC: G02B6/36
  • IPC: G02B6/36 G02B6/44
Optical fiber array with high reliability
Abstract:
An optical fiber array with high reliability, which relates to the technical field of optical fibers is disclosed. The optical fiber array is composed of three parts, namely, optical fiber positioning substrate (1), cover plate (2) and optical fiber ribbon (3). One end of the optical fiber ribbon is striped to be a naked fiber (4). The naked fiber (4) is pressed into the micro-groove array of the optical fiber positioning substrate (1) by the cover plate (2) and glued and fixed with a glue layer (5), and a transitional region between the stripped part and the unstripped part of the optical fiber ribbon (3) is glued and fixed onto a rear half of the optical fiber positioning substrate (1) with the glue layer (5). It has a reasonable and novel structural design. Through frosting of the surfaces of the positioning substrate (1) and the cover plate (2) to be bonded with glue, gluing area between the glue layer and the optical fiber positioning substrate, the cover plate and the optical fiber ribbon can be increase and bonding strength of the glue layer can be enhanced so that it can work in harsh environment of high temperature and humidity without de-bonding to ensure positioning accuracy of optical fibers.
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