An apparatus is provided. A substrate and a cover plate are provided. A sensor layer is formed on at least one of the substrate and the cover plate. The sensor layer includes a plurality of row electrodes and a plurality of column electrodes interleaved with the plurality of row electrodes, where each row electrode and each column electrode is formed of a plurality of stair-stepped diamonds. An insulator is also included so as to electrically isolate the plurality of row electrodes and the plurality of column electrodes, where the insulator is substantially transparent to visible spectrum light. The apparatus employs mirror symmetric row sensor routing placement. The routing placement provides reduction of row bonding pads by 50% to enhance manufacturing yield. Rearranging unit cells on the same layout results in a decrease of RC parasitics by 50%.